◎ Tenacity and ductility enhancement: material can be embossed for ductility.
◎ Temperature compactness for density reinforcement: limitation of powder formative density 7.0g/cm3 promotion of temperature compacting density up to 7.4g/cm3.
◎ Capillary seal-off treatment:
◎ Product can be electroplating finish after capillary seal-off
◎ The organization's air to be tightness organization's air tightness is promoted to 98% able and lowers cost.
◎ Apply CAD in design of product and mold for more precision and economic specification.
◎ With good knowledge of P/M material, the engineers are able to offer the most
◎ Cooperation of teamwork and consolidation of technology